Case Study 6 | UCIe & Chiplets
UCIe-Based Chip-to-Chip Interconnect Verification
Customer
Connectivity Silicon Co.
Max Lane Rate
112G (Record)
Team Size
6 to 7 engineers
Delivery
Gen 1: 5-6 mo | Gen 2: 3 mo
1 Challenge
Verify two generations of a chip-to-chip interconnect: an AXI adapter layer in Gen 1, then four 112G lanes with switchable Tx/Rx splits and multiple FLIT modes in Gen 2.
2 Approach
Designed custom AXI master and slave VIPs to drive AXI traffic, and enhanced the UVM testbench for each generation's design changes and new operating modes.
3 Outcome
Both generations delivered successfully. Gen 1 took 5 to 6 months, and Gen 2 took about three months. 112G is the highest lane rate in our delivered record.
4 Technical Scope
- Gen 1: 112G x 3, 312.5 Gbps aggregate with AXI adapter layer
- Gen 2: 4 x 112G with switchable Tx/Rx splits (Tx3/Rx1 for writes, Tx1/Rx3 for reads, Tx1/Rx1 for low power)
- Specialized FLIT modes optimized for latency and bandwidth
- Custom AXI master and slave verification IP (VIP)
5 Engagement Facts
Customer Profile: High-speed connectivity semiconductor company
Resource Allocation: 6 to 7 engineers
Timeline: 5 to 6 months for Gen 1, about 3 months for Gen 2
Resource Allocation: 6 to 7 engineers
Timeline: 5 to 6 months for Gen 1, about 3 months for Gen 2