Case Study 6 | UCIe & Chiplets

UCIe-Based Chip-to-Chip Interconnect Verification

Customer Connectivity Silicon Co.
Max Lane Rate 112G (Record)
Team Size 6 to 7 engineers
Delivery Gen 1: 5-6 mo | Gen 2: 3 mo

1 Challenge

Verify two generations of a chip-to-chip interconnect: an AXI adapter layer in Gen 1, then four 112G lanes with switchable Tx/Rx splits and multiple FLIT modes in Gen 2.

2 Approach

Designed custom AXI master and slave VIPs to drive AXI traffic, and enhanced the UVM testbench for each generation's design changes and new operating modes.

3 Outcome

Both generations delivered successfully. Gen 1 took 5 to 6 months, and Gen 2 took about three months. 112G is the highest lane rate in our delivered record.

4 Technical Scope

  • Gen 1: 112G x 3, 312.5 Gbps aggregate with AXI adapter layer
  • Gen 2: 4 x 112G with switchable Tx/Rx splits (Tx3/Rx1 for writes, Tx1/Rx3 for reads, Tx1/Rx1 for low power)
  • Specialized FLIT modes optimized for latency and bandwidth
  • Custom AXI master and slave verification IP (VIP)

5 Engagement Facts

Customer Profile: High-speed connectivity semiconductor company
Resource Allocation: 6 to 7 engineers
Timeline: 5 to 6 months for Gen 1, about 3 months for Gen 2

Building 112G+ chip-to-chip or die-to-die interfaces?

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